Explore the New Age of Superior Technologies
TECHNOLOGIES & PRODUCTS
The SLIDE-FIT ELECTRICAL CONTACT TERMINATION TECHNOLOGY embodies an effective interface method between connector contacts and between contact terminations and printed circuit boards to achieve gas-tight, controlled electromechanical interface. The S-FECT Technology is a disruptive technology for the connector industry because it eliminates the need to employ complex contact interface geometries and eliminates the need to solder contacts to PCBs. S-FECT Technology is superior to any press-fit contact interface technology in both performance and cost.
The HYPERBITS CONNECTOR featuring S-FECT interface technology, is a high-speed blind-mating connector which embodies several interconnect innovations, it is a unique product unequalled in design and performance sophistication. The most distinguishing feature is the ability to blind-mate directly to the backplane fully eliminating a second mating connector end effectively eliminating the corresponding insertion point in the signal transmission line. HYPERBITS is fully compatible to the PICMG Compact-PCI Serial Space Specification and it fully conforms to the newly developed ESCC 3401 detail specification for press-fit interfaces.
smartNsafe™ HIGH VOLTAGE POWER TRANSMISSION
smartNsafe is a 1000VDC state-of-the-art modular power distribution system suitable for military, aerospace and data center secondary power distribution applications featuring zero live-line exposure, built-in continuous fault monitoring and detection for partial discharge, conductor degradation or accidental disconnection with ultra-fast failure-prevention capabilities. The smartNsafe intelligent cable construction employs advanced engineered, densely packed fluoropolymer materials offering the most reliable long-term dielectric and mechanical endurance. The smartNsafe system offers the highest power to weight ratio available in any industry for near-load applications requiring safety and long-term reliability.
CRYOMATE™ SUPERCONDUCTIVE CONNECTOR
Rare-Earth Barium Copper Oxides (ReBCO) conductors are produced in form of layered tapes of superconductive material densely clad in copper. Joining ReBCO conductors consistently and effectively with minimal packaging and without special tools continues to remain a challenge. The CRYOMATE connector design ensures a tight connection directly between the superconductive layers and features a minimalistic housing with built-in quench prevention elements. The CRYOMATE design embodies three industry-first innovations. We are offering a joint-development opportunity for the right partner with capabilities to perform testing and validation of the CRYOMATE design for various conductor configurations.
HEATBUS™ CPC THERMAL TRANSFER SYSTEM
The HEATBUS Complete Phase Change heat transfer system is an achievement in thermal transfer innovation resulting after in-depth investigations and experimentation with principles such as Ranque-Hilsch vortex and Joule-Thomson effect under various conditions of temperature and pressure. Due to its operational versatility and rugged construction, the HEATBUS heat transfer system can be adapted to diverse cooling applications in electrical propulsion, high-current solid-state switching and computing applications such as immersion cooling and on-chip cooling.
HYPER-SPLIT™ EMHD ELECTROLYSIS CELL
The HYPER-SPLIT™ ELECTROMAGNETIC HYDRODYNAMIC ELECTROLYSIS CELL aligns electromagnetic, electrochemical, and thermodynamic principles inside one innovative device that is capable to dissociate water into hydrogen and oxygen, convert electrical power from AC input to steady DC output, pump fluid and recover power from low-grade thermal energy. The HYPER-SPLIT™ ELECTROMAGNETIC HYDRODYNAMIC ELECTROLYSIS CELL is a milestone achievement validating our commitment to produce disruptive technologies. HYPER-SPLIT™ opens the way to discover new opportunities for clean and sustainable energy recovery, offsetting, and storage applications.
Securing a strong IP Portfolio validates our ambition to develop new technologies and unique products while enabling exclusive advantage and distinct positioning for our customers and investors. Contact us for further details related to our intellectual property available for licensing or joint development opportunities.