MINDREACH i2i SL is an Intellectual Property Asset Generation and Management firm dedicated to creating disruptive technologies and innovative products in areas of high-performance interconnect systems, electrical power transfer and conversion, thermal transfer and energy recovery. Our IP assets are offered under licensing agreements.
Explore the New Age of Superior Technologies
TECHNOLOGIES & PRODUCTS
S-FECT™ TECHNOLOGY
The SLIDE-FIT ELECTRICAL CONTACT TERMINATION (S-FECT™) TECHNOLOGY replaces Press-Fit technology.
S-FECT™ embodies an effective and ingenious method to achieve gas-tight electromechanical interface between contact terminations and via holes in PCBs. The S-FECT Technology is a disruptive technology for the connector industry because it eliminates the process and tooling associated with press-fit installation and eliminates the need to solder contacts to PCBs. S-FECT Technology is superior to any press-fit contact interface technology in both performance and cost. S-FECT Technology can be adapted to contact terminations with diameters as small as 0.25mm for 110Gbps applications and can offer mounting solutions to nano and micro connector packages directly to PCBs without soldering and without elaborate installation tooling. S-FECT technology is licensed to Performance Interconnect SAS who holds exploitation and sublicensing rights.
HYPERBITS™ CONNECTOR
The HYPERBITS CONNECTOR featuring S-FECT interface technology, is a high-speed blind-mating connector which embodies several interconnect innovations, it is a unique product unequalled in design and performance sophistication. The most distinguishing feature is the ability to blind-mate directly with the backplane fully eliminating a second mating connector end effectively eliminating the corresponding insertion point in the signal transmission line. HYPERBITS is designed to be fully compatible to the PICMG Compact-PCI Serial Space Specification and conforms to the newly developed ESCC 3401/098 detail specification for press-fit interfaces. With support from CNES and Thales Alenia Space, HYPERBITS™ was awarded a development Contract from ESA under ATRES 4.0 Core Competitiveness Generic Programme Line, Advanced Technology, Activity Reference 5C.461. HYPERBITS technology is licensed to Performance Interconnect SAS who holds exploitation and sublicensing rights.
HEATBIND™ ADVANCED SOLID THERMAL RETAINER FOR SPACE VPX AND ADHA CONDUCTION COOLING APPLICATIONS
The HEATBIND™ patented technology is the world's most effective thermal retainer system for conduction cooled embedded computing applications. The HEATBIND™ solid thermal retainer incorporated into mono-block heat frames, is available in 3U and 6U configurations adaptable to any design. HEATBIND™ is significantly superior to wedgelocks, ICE-LOKS or any other open or patented retainer technology.
HEATBIND™ is licensed to Performance Interconnect SAS who holds exploitation and sublicensing rights.
PHENOMENA™ I - DIAMOND THERMAL INTERFACE MATERIAL WITH SUPERIOR THERMAL CONDUCTION BETWEEN TWO SURFACES
The PHENOMENA™ I - PATENT-PENDING Thermal Interface Material is used to connect processors to heat spreaders, heat plates or to achieve large area metal-to-metal interfaces with low thermal resistance. The matrix special formulation has an ultra-high concentration of highly diffusive nano particles binding high-quality diamonds in a monolayer configuration between two surfaces to achieve the most efficient thermal transfer mechanism. The high-performance compound is compatible with high vacuum environment for space-flight applications.
PHENOMENA™ II - COPPER DIAMOND COMPOSITE ALLOY WITH 760 TO 780 W/mK THERMAL CONDUCTIVITY
The PHENOMENA™ II - Copper-Diamond (CuDi) Composite Alloy is a superlative advancement in material technology achieved through a complex sintering process combining high-quality mono-crystalline diamonds with a natural Tc > 2000W/mK and pure copper powder with a TC = 394 W/mK. The sintered composite material displays nearly "magic" thermal conductivity performance with a TC from 760 to 780 W/mK and is an extraordinary solution in conduction cooling applications regardless of their environment. It works with equal effectiveness under extreme G forces and under the harsh conditions of deep space in total absence of gravity.
smartNsafe™ HIGH VOLTAGE POWER TRANSMISSION 100kW and 200kW options
smartNsafe is a 800 to 1000 Volt DC state-of-the-art modular power distribution system suitable for aerospace and data center secondary power distribution applications featuring zero live-line exposure, built-in continuous fault monitoring and detection for partial discharge, conductor degradation or accidental disconnection with ultra-fast failure-prevention capabilities. The smartNsafe intelligent cable construction employs advanced engineered, densely packed fluoropolymer materials offering the most reliable long-term dielectric and mechanical endurance. The smartNsafe system offers the highest power to weight ratio available in any industry for near-load applications requiring safety and long-term reliability.
CRYOMATE™ SUPERCONDUCTIVE CONNECTOR
Rare-Earth Barium Copper Oxides (ReBCO) conductors are produced in form of layered tapes of superconductive material densely clad in copper. Joining ReBCO conductors consistently and effectively with minimal packaging and without special tools continues to remain a challenge. The CRYOMATE connector design ensures a tight connection directly between the superconductive layers and features a minimalistic housing with built-in quench prevention elements. The CRYOMATE design embodies three industry-first innovations. We are offering a joint-development opportunity for the right partner with capabilities to perform testing and validation of the CRYOMATE design for various superconductor configurations.
HEATBUS™ THERMAL TRANSFER SYSTEM
The HEATBUS thermal transfer system is an innovation resulting after in-depth investigations and experimentation with thermodynamic principles under various conditions of temperature and pressure. Due to its operational versatility and rugged construction, the HEATBUS transfer system can be adapted to diverse cooling applications in spaceflight electronics, mission critical electronics, electrical propulsion, high-current solid-state switching and computing applications such as on-chip cooling for harsh environment applications.
HYPER-SPLIT™ EMHD ELECTROLYSIS CELL
The HYPER-SPLIT™ ELECTROMAGNETIC HYDRODYNAMIC ELECTROLYSIS CELL aligns electromagnetic, electrochemical, and thermodynamic principles inside one innovative device that is capable to dissociate water into hydrogen and oxygen, convert electrical power from AC input to steady DC output, pump fluid and recover power from low-grade thermal energy. The HYPER-SPLIT™ ELECTROMAGNETIC HYDRODYNAMIC ELECTROLYSIS CELL is a milestone achievement validating our commitment to produce disruptive technologies. HYPER-SPLIT™ opens the way to discover new opportunities for clean and sustainable energy recovery, offsetting, and storage applications.
The Presslift™ is a dual function precision instrument to complement high-quality analog audiophile record players. The Presslift™ attenuates resonant waves coupled with the platter during playback, especially when the volume is loud. Additionally, it has a built-in complex spiral and it lifts the tonearm at the end of the play using inertia from the platter and subsequently, the top section comes to a complete stop while the platter continues to spin. The device is basically a flex demonstrating our mechanical engineering prowess and capability to design and produce a precision, complex mechanical device employing multiple components within a luxurious package for the upper echelon in the high-end analog audio industry. The Presslift™ received many acclamations and press reviews from top global publications and it was awarded a "newcomer-to-the-industry" position in 2019 by the prestigious and largest HI-FI trade organization in the world, the HIGH END Society. As this product does not quite align with our core technologies, we are currently seeking interested parties to license the Presslift with a base royalty of 10% for a long-term agreement.
INTELLECTUAL PROPERTY
PORTFOLIO
Securing a strong IP Portfolio validates our ambition to develop new technologies and unique products while enabling exclusive advantage and distinct positioning for our customers and investors. Contact us for further details related to our intellectual property available for licensing or joint development opportunities.